Nepcon Japan (³ÜÄÜ ÀüÀÚÁ¦Á¶ ¹Ú¶÷ȸ)Àº ÀüÀÚ Á¦Á¶½ÇÀå, ÃøÁ¤, ÆÐŰ¡, ÀüÀÚºÎǰ, PWB, ÈÀΰøÁ¤, LEDºÐ¾ß·Î ±¸¼ºµÈ 7°³ÀÇ ÀüÀÚ Àü¹®ÀüÀÌ µ¿½Ã °³ÃֵǴ Á¾ÇÕ ÀüÀÚ »ý»ê ±âÀÚÀçÀüÀÔ´Ï´Ù.
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Nepcon Japan (³ÜÄÜ ÀüÀÚÁ¦Á¶ ¹Ú¶÷ȸ)Àº ÀüÀÚ Á¦Á¶½ÇÀå, ÃøÁ¤, ÆÐŰ¡, ÀüÀÚºÎǰ, PWB, ÈÀΰøÁ¤, LEDºÐ¾ß·Î ±¸¼ºµÈ 7°³ÀÇ ÀüÀÚ Àü¹®ÀüÀÌ µ¿½Ã °³ÃֵǴ Á¾ÇÕ ÀüÀÚ »ý»ê ±âÀÚÀçÀüÀÔ´Ï´Ù. ÇØ´ç »ê¾÷±º
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Rx Japan Ltd.
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✅ µ¿½Ã°³ÃÖ Àü½Ãȸ - Nepcon Japan (µµÄì ³ÜÄÜ ÀüÀÚÁ¦Á¶ »ê¾÷ ¹Ú¶÷ȸ ) - Factory Innovation Week (µµÄì °øÀå Çõ½Å ±â¼ú ¹Ú¶÷ȸ) - AUTOMOTIVE WORLD (Â÷¼¼´ë ÀÚµ¿Â÷ Á¦Á¶»ê¾÷Àü) - WEARABLE EXPO : Wearable Device & Technology Expo (¿þ¾î·¯ºí ±â¼úÀü) - SMART LOGISTICS Expo (½º¸¶Æ® ¹°·ù ÀÚµ¿È ¹Ú¶÷ȸ)
✅ Àü½ÃºÐ¾ß - INTERNEPCON JAPAN : ÀüÀÚÁ¦Á¶,SMT ¸ðµçÁ¾·ùÀÇ Àåºñ¿Í Àç·á Àü½Ã
- ELECTROTEST JAPAN : ÀüÀÚÁ¦Á¶ ¹× ¿¬±¸°³¹ßÀÇ ½ÃÇè/°Ë»ç¸¦ À§ÇÑ Àü½Ãȸ
- IC PACKAGING TECHNOLOGY EXPO : ¼¾¼, MEMS µð¹ÙÀ̽º ¹× ±¤µð¹ÙÀ̽º¿ë IC ÆÐŰ¡ ±â¼ú Àü½Ã
- ELECTRONIC COMPONENTS & MATERIALS EXPO : °¡ÀüÁ¦Ç° ¹× »ê¾÷¿ë±â±â¸¦ À§ÇÑ ºÎǰ/ÀåÄ¡/Àç·á
- PWB EXPO (Printed Wiring Boards Expo) : PCB/PWB, PCB¿ë Àç·á,¼³°è&°³¹ß¼ºñ½º,¼³°è,Åø Àü½Ã
- FINE PROCESS TECHNOLOGY EXPO : ÀüÀÚÁ¦Á¶ °ü·Ã °ø ±â¼ú Àü¹® Àü½Ãȸ
- LED& LASER DIODE TECHNOLOGY EXPO : LED Á¶¸í ¹× ·¹ÀÌÁ® ´ÙÀÌ¿Àµå ±â¼ú Àü½Ãȸ |
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